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Original document  : ARC-2018-0261-Details_of_procedures_for_oneM2M_to_OCF_exposure_in_Rel-3
Previous revision (RNb  1 ) : ARC-2018-0261-Details_of_procedures_for_oneM2M_to_OCF_exposure_in_Rel-3
Current document   ( RNb 2 )   :   ARC-2018-0261R01-Details_of_procedures_for_oneM2M_to_OCF_exposure_in_Rel-3 
Following revision (RNb  3 ) :  ARC-2018-0261R02-Details_of_procedures_for_oneM2M_to_OCF_exposure_in_Rel-3
 
Shortname Details of procedures for oneM2M to OCF exposure in Rel-3
Technical Status Noted 
Document Status Changed 
Physical Status Uploaded 
Document Class CR 
Document Type Change request 
Working Group ARC - WG2 - Architecture 
Source Qualcomm Inc. (TIA) 
Submitter Name / Organisation Josef Blanz (Qualcomm (TIA)) 
Meeting ARC 37-2018-09-16 23:00:00 
Against TS/TR (Version) Details of procedures for oneM2M to OCF exposure in Rel-3 
Last modified hughes , 2018-09-20 06:30:43 
Creation Date 2018-09-19 02:10:41 
File ARC-2018-0261R01-Details_of_procedures_for_oneM2M_to_OCF_exposure_in_Rel-3.DOC (1651 ko)
Upload Date : 2018-09-19 02:10:41
 
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